Thermal Grizzly CPU Kühler

Wärmeleitpaste mit 12,5 W/m·K Leitfähigkeit, Einsatzbereich −250 bis +350 °C, nicht elektrisch leitend, Viskosität 120–170 Pa·s und 1 g Inhalt.

Speziell für anspruchsvolles Overclocking entwickelt liefert die Paste zuverlässige Performance ohne Aushärten und mit langzeitstabiler Konsistenz. Die fein abgestimmte Formel auf Basis von Nano-Aluminium- und Zinkoxid-Partikeln füllt Mikrounebenheiten sauber aus und sorgt für niedrige thermische Übergangswiderstände. Dank präzisem Applikator gelingt eine gleichmäßige, dünne Schicht auf CPU, GPU & Heatsink.

• Leitfähigkeit: 12,5 W/m·K für effiziente Wärmeübertragung.
• Temperaturbereich: −250 bis +350 °C für Kryo-Setups bis Hochlast.
• Viskosität: ca. 120–170 Pa·s – leicht zu verteilen, bleibt formstabil.
• Zusammensetzung: Nano-Aluminium & Zinkoxid, nicht elektrisch leitend.
• Dichte: ~3,7 g/cm³ für dünne, homogene Schichten.
• Handhabung: keine Aushärtung, langzeitstabil; flacher Aufsatz/Spachtel für präzises Auftragen.
• Variante: 1 g Tube, Modell TG-K-001-BS (Kryonaut).

Flüssigmetall-Kühlpaste, Silberpaste, Dichte: 6,29 g/cm³, Betriebstemperatur: -50 - 200° C, 1 Gramm

Water cooler optimized for Intel LGA1851 direct-die mounting with a nickel-plated copper microfin cold plate, low-flow-resistance jet channels and integrated RGB lighting.

The Intel 1851 Mycro Direct-Die Pro RGB V1 is designed to sit directly on a delidded Intel CPU to send heat straight into the water loop, with an acrylic-and-aluminum cover and controllable ARGB illumination.

• Direct-die installation for LGA1851 CPUs — requires removal of the ILM and CPU heatspreader; delidding is at your own risk


• Nickel-plated copper cold plate with microfins and a jet system, engineered for low flow resistance


• Acrylic layer tempered after milling to prevent stress cracks beneath the anodized aluminum lid


• Digital aRGB LEDs under the lid, controllable via a 3-pin ARGB header (+5V/DATA/GND); LEDs also illuminate the G1/4 fittings


• G1/4-inch female threading for standard fittings


• Tested with KryoSheet and thermal pads — additional pad thickness affected contact pressure and showed no significant temperature improvements

Built for users who want a compact direct cooling path from the CPU die into a water loop while retaining customizable RGB lighting.

Thermally conductive gap filler to replace GPU thermal pads, with an operating temperature range of -40°C to +120°C.

TG Putty is a thermally conductive compound intended for GPU applications, offered in multiple sizes and performance variants.

• Replaces standard GPU thermal pads to bridge uneven surfaces


• Operating temperature: -40°C to +120°C


• Available contents: 30 g and 100 g


• Available variants: Basic, Advance, Pro


• Datasheet and technical information available for download

Ensures reliable thermal contact across gaps to support heat transfer between GPU components.

Thermal putty that serves as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates for height differences from 0.2 to 3.0 mm.

TG Putty is easy to apply with the supplied spatulas or by hand (gloves recommended) and is available in Basic, Advance and Pro variants that differ by thermal conductivity.

• Electrically non-conductive alternative to conventional thermal pads


• Fills gaps from 0.2–3.0 mm for VRAM, VRM and SMD components


• Apply broadly with spatulas or shape into small pellets for precise placement


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Operating temperature range −40°C to +120°C


• Advance variant includes three spatulas for application

Designed for GPU modifications and cooler conversions, it adapts to varied factory pad thicknesses for tailored thermal contact.

Wärmeleitpaste, Hellgrau

Wärmeleitpaste für Prozessorkühler, Silber

Thermal Grizzly Duronaut is a high-performance thermal paste designed for excellent heat transfer and long-term stability.

Key features:
✔ Extremely durable
✔ High thermal conductivity
✔ Non-conductive & safe for electronics

Package includes:

1 × Duronaut thermal paste 2 g
1 × Applicator
1 × TG Spatula
1 × TG Spatula Pro

The PhaseSheet PTM is a thermal pad based on a phase change material (PCM). The pads, which are solid at room temperature, can be easily applied and liquefy during operation, allowing them to effectively dissipate heat like a thermal paste. PhaseSheet PTM is electrically non-conductive and can therefore be used in many areas, with the primary application being in processors and graphics chips.

The Intel 1851 Delid-Die-Mate V1 is a tool for removing the heat spreader (delidding) from Intel processors in the "Intel Core Ultra 200" series (LGA1851 socket). By removing the Integrated Heat Spreader (IHS), CPUs can be cooled using the "Direct-Die" method, where the cooler is mounted directly onto the processor chip. This enables the most efficient transfer of thermal dissipation power (TDP), or simply put, the heat, from the processor to the cooling loop.

 

Caution: Removing the heat spreader (delidding) of a processor is done at your own risk! Delidding the CPU voids the manufacturer's warranty! Damage caused during delidding is not covered by the manufacturer! CPU should be heated. 

Thermal putty is an electrically non-conductive, flexible gap filler that replaces conventional thermal pads on GPUs and bridges height differences from 0.2 to 3.0 mm.

Formulated for GPU modifications, TG Putty is easy to shape for precise contact with VRAM and SMD components and can be applied broadly with a spatula or formed by hand.

• Electrically non-conductive alternative to thermal pads


• Fills gaps from 0.2 to 3.0 mm for consistent contact


• Apply with spatulas or by hand (gloves recommended)


• Available in variants with different thermal conductivities


• Operating range −40°C to +120°C


• Not suitable for use on processors (IHS or direct die) or directly on the GPU die

Easy to shape and tailor-made for memory and voltage-regulator contacts, it simplifies GPU pad replacement and cooler modifications.

Hochleistungs-Wärmeleitpaste mit 14,2 W/m·K, 2-g-Spritze (TG-KE-002-R), nicht elektrisch leitend, optimiert für niedrige Temperaturen (-250 bis +350 °C), inkl. Applikatoren – ideal für CPU/GPU und extremes Overclocking.

Kryonaut Extreme nutzt eine extrem feine Partikelgröße und minimal mögliche Schichtdicke, um die Wärmeübertragung auf ein neues Level zu heben – selbst bei LN2- oder Trockeneis-Setups. Die Rezeptur bleibt auch unter hoher Last formstabil und trocknet nicht aus, zusätzliche nano-Aluminiumoxid-Partikel füllen mikroskopische Unebenheiten zuverlässig. So holst du aus High-End-Kühlern und Wasserkühlungen konstant niedrige Temperaturen heraus.

• Wärmeleitfähigkeit: 14,2 W/m·K für maximale Performance bei Luft- und Wasserkühlung
• Temperaturbereich: ca. −250 bis +350 °C – geeignet von Alltagsbetrieb bis Sub-Zero-OCs
• Sicherheit: elektrisch nicht leitend und nicht korrosiv – minimiert Kurzschlussrisiken
• Konsistenz: hochviskos (≈130–180 Pa·s) für präzises, dünnes Auftragen
• Inhalt & Farbe: 2 g in Spritze, charakteristische „pink“ Paste
• Lieferumfang: 2 Applikatoren, Quick-Start-Guide, Echtheitscode
• Einsatzgebiet: CPU/GPU, Heatsinks, Direct-Die & Bench-Sessions mit LN2/DI

Thermal putty acts as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates height differences from 0.2 mm to 3.0 mm while remaining easy to apply.

The TG Putty line is available in three variants with differing thermal conductivity and is supplied with spatulas to enable straightforward, large-area application.

• Electrically non-conductive alternative to conventional thermal pads


• Compensates gaps from 0.2–3.0 mm


• Three variants: Basic (medium), Advance (good), Pro (excellent) thermal conductivity


• Includes three spatulas for application


• Operating temperature range −40°C to +120°C


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Apply only to clean, degreased surfaces (e.g., TG Cleaning Wipes or isopropanol)

Suited for replacing VRAM and VRM pads on single and larger graphics cards and for converting coolers to GPU water cooling setups.

Thermal Grizzly Duronaut is a high-performance thermal paste designed for excellent heat transfer and long-term stability.

Key features:
✔ Extremely durable
✔ High thermal conductivity
✔ Non-conductive & safe for electronics

Package includes:

1x Duronaut thermal paste 6g
1x Applicator
1x TG Spatula
1x TG Spatula Pro
 

Wärmeleitpaste, hellgrau, Wärmeleitfähigkeit: 12.5 W (mK) 1g

Thermo-Pad, Red Brown

Thermo-Pad, Red Brown

Thermal Grizzly TG Shield ist eine Hochtemperatur-Konformbeschichtung zum Schutz von Komponenten vor Kurzschlüssen durch Flüssigmetall. TG Shield trocknet schnell für eine schnelle Anwendung und bietet in Kombination mit Flüssigmetall zuverlässigen Schutz von PC-Komponenten.

Wärmeleitpaste, für Overclocking konzipiert, 14,2 W/m*K Wärmeleitfähigkeit, keine Aushärtung erforderlich, 33.84 Gramm

Der AM5 High Performance Heatspreader ist ein Upgrade für die Ryzen 7000 CPUs von AMD. Die diamantgefräste Präzisionsoberfläche des Heatspreaders aus vernickeltem Kupfer bietet eine 240% größere Oberfläche. Dadurch ermöglicht der AM5 Heatspreader die maximale Wärmeabfuhr bei Luft- und Wasserkühlern.

Thermo-Pad, Red Brown

Wärmeleitpaste, Thermal Grizzly Duronaut Pro 6g, kombiniert hervorragende Wärmeleitfähigkeit, extreme Langzeitstabilität, elektrische Nichtleitfähigkeit und keine Aushärtung im Laufe der Zeit für anspruchsvolle PC- und industrielle Kühlsysteme.

Das speziell entwickelte Silikonöl, Aluminium-Mikropulver und Zinkoxid-Nanopulver helfen, den Pump-out-Effekt zu minimieren, die Haftung auf der Oberfläche zu verbessern und den thermischen Kontaktwiderstand zu reduzieren.

Das Paket enthält Duronaut Pro 6g, einen Applikator, TG Spatula und TG Spatula Pro für effizientes Verteilen in dünnen Auftragsschichten.

Ideal für Gamer, Overclocker und anspruchsvolle Kühl-Setups, die eine langlebige, effiziente Wärmeübertragung zwischen CPU und Kühler benötigen.

CPU-Kontaktrahmen für 13th gen Intel Raptor Lake & 14th gen Raptor Lake-S, kann helfen die Kühlleistung durch besseren Kontakt zwischen CPU und Kühler zu verbessern - bitte sehen Sie sich vor der Installation das Installationsvideo an

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Aeronaut thermal grease is the ideal beginner's product with high effectiveness. Great surface protection, as well as good heat transfer capabilites make Aeronaut the ideal choice for users who want to optimize their cooling solution in an effective way, or maybe want to use an alternative to the thermal grease included with their hardware, with a remarkable cost effectiveness to boot.

• very good thermal conductivity
• long-term durability
• no curing
• no electrical conductivity