Thermal Grizzly CPU Kühler - Seite 3

Die AM5 M4 Backplate ist eine optionale Montageplatte, welche die original AM5-Backplate ersetzt. Einige CPU-Kühler verwenden ein Montage-Kit, das mit Schrauben mit M4-Gewinde ausgeliefert wird. Diese sind nicht mit dem UNC 6-32-Gewinde kompatibel, dass bei der AM5-Backplate verwendet wird. Mit der AM5 M4 Backplate können entsprechende CPU-Kühler, besonders AiO-Wasserkühlungen, verwendet werden.

Wärmeleitpad bietet hohe Kompression, sehr hohe Kompressibilität und Wärmeleitfähigkeit in einer elektrisch nicht leitfähigen Ausführung für eine einfache Installation.

Thermal Grizzly Minus Pad High Compression ist für PC-Enthusiasten und Modder konzipiert, die ein flexibles Pad benötigen, das unterschiedliche Bauteilhöhen zuverlässig ausgleicht – ohne komplizierte Messungen – und sich für eine Vielzahl von Builds zuschneiden lässt.

• Hohe Kompressibilität hilft, Höhenunterschiede auszugleichen, wenn der exakte Spalt unbekannt ist
• Hervorragende Wärmeleitfähigkeit unterstützt effizienten Wärmeaustausch
• Elektrisch nicht leitfähig und hilft, Kurzschlüsse in empfindlicher Elektronik zu vermeiden
• Vielseitig einsetzbar für SSDs, Laptops, VRMs und Grafikkarten

Ideal für praktische Kühl-Upgrades, bei denen Toleranz, Sicherheit und einfache Handhabung zählen.

Water cooler optimized for Intel LGA1851 direct-die mounting with a nickel-plated copper microfin cold plate, low-flow-resistance jet channels and integrated RGB lighting.

The Intel 1851 Mycro Direct-Die Pro RGB V1 is designed to sit directly on a delidded Intel CPU to send heat straight into the water loop, with an acrylic-and-aluminum cover and controllable ARGB illumination.

• Direct-die installation for LGA1851 CPUs — requires removal of the ILM and CPU heatspreader; delidding is at your own risk


• Nickel-plated copper cold plate with microfins and a jet system, engineered for low flow resistance


• Acrylic layer tempered after milling to prevent stress cracks beneath the anodized aluminum lid


• Digital aRGB LEDs under the lid, controllable via a 3-pin ARGB header (+5V/DATA/GND); LEDs also illuminate the G1/4 fittings


• G1/4-inch female threading for standard fittings


• Tested with KryoSheet and thermal pads — additional pad thickness affected contact pressure and showed no significant temperature improvements

Built for users who want a compact direct cooling path from the CPU die into a water loop while retaining customizable RGB lighting.

The Intel 1851 Delid-Die-Mate V1 is a tool for removing the heat spreader (delidding) from Intel processors in the "Intel Core Ultra 200" series (LGA1851 socket). By removing the Integrated Heat Spreader (IHS), CPUs can be cooled using the "Direct-Die" method, where the cooler is mounted directly onto the processor chip. This enables the most efficient transfer of thermal dissipation power (TDP), or simply put, the heat, from the processor to the cooling loop.

 

Caution: Removing the heat spreader (delidding) of a processor is done at your own risk! Delidding the CPU voids the manufacturer's warranty! Damage caused during delidding is not covered by the manufacturer! CPU should be heated. 

Wärmeleitpad bietet eine außergewöhnlich hohe Kompressibilität mit hervorragender Wärmeleitfähigkeit und ist dafür ausgelegt, unterschiedliche Höhenunterschiede über mehrere Kontaktpunkte zu überbrücken.

TG Minus Pad High Compression ist besonders praktisch beim Modifizieren von Grafikkarten mit einem GPU-Wasserkühler oder beim Ersetzen von Wärmeleitpads an einem GPU-Kühler, da ein Pad-Typ Komponenten wie VRAM, Spannungsregler und andere Kontaktflächen im selben Setup abdecken kann.

• Sehr hohe Kompressibilität
• Hervorragende Wärmeleitfähigkeit, auch bei starker Kompression
• Passt sich gut an Höhentoleranzen an
• Elektrisch nicht leitfähig
• Einfach zu handhaben

Ideal, wenn die exakte Pad-Dicke ungewiss ist, und hilft, zuverlässigen Kontakt aufrechtzuerhalten, während Toleranzen ausgeglichen werden.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermo-Pad, Schwarz (Packung mit 4)

Thermal pad with extremely high thermal conductivity, outstanding compressibility and electrical non-conductivity for reliable heat transfer on SSDs, GPU coolers and electronic components.

The Minus Pad Pro is part of the Minus Pad series and builds on the proven Minus Pad 8 to deliver improved thermal conductivity and compressibility while remaining easy to use.

• Excellent thermal conductivity


• Outstanding compressibility


• Easy to use


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules


• Color: gray

Provides a compressible, electrically isolating interface to enhance thermal contact between components and cooling solutions.

Der Hitzeverteiler der Ryzen-7000-Prozessoren ist sehr dick, was teilweise auf die Kompatibilität mit älteren CPU-Kühlern für den AM4-Sockel zurückzuführen ist. Die unnötige Dicke des Hitzeverteilers reduziert die Wärmeleitfähigkeit, so dass die CPUs bei sehr hohen Temperaturen von etwa 95 Grad Celsius arbeiten. Durch Entfernen des Hitzeverteilers ("Decap", "Delidding") kann der CPU-Kühler direkt auf den Chiplets des Ryzen-7000-CPU montiert werden, was die Temperaturen drastisch reduziert. Um Schäden an empfindlichen Chips zu vermeiden und Betriebsprobleme (z.B. RAM) zu verhindern, ersetzt das Ryzen-7000-Direct-Die-Rahmen den Socket-Aktivierungsmechanismus (SAM) auf dem Motherboard.

Thermo-Pad, Red Brown

Thermal pads offering extremely high thermal conductivity, outstanding compressibility and electrically non-conductive properties for use on SSDs, GPU coolers and electronic components.

The Minus Pad Pro combines excellent heat transfer with exceptional compressibility while remaining electrically non-conductive, making it suitable for cooling SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for tight contact


• Electrically non-conductive for safe use on electronics


• Easy to use


• Designed for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Based on the proven Minus Pad 8 and developed to further improve thermal conductivity and compressibility for reliable component cooling.

Thermal pads offer extremely high thermal conductivity, outstanding compressibility, electrical insulation, and straightforward installation for efficient component cooling.

The Minus Pad Pro is the Pro-series thermal pad refined from the Minus Pad 8 to deliver improved thermal conductivity and compressibility for SSDs, GPU coolers, water blocks and electronic components.

• Excellent thermal conductivity


• Outstanding compressibility for tight contact


• Electrically non-conductive


• Easy to apply


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Designed to enhance heat transfer between components and cooling solutions in compact assemblies.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal pad delivering excellent thermal conductivity and outstanding compressibility while remaining electrically non-conductive and easy to apply.

The Minus Pad Pro is part of the Minus Pad series, developed from the proven Minus Pad 8 to boost thermal performance and compressibility for components such as SSDs, GPU coolers, GPU water-cooling setups, voltage regulators and memory modules.

• Excellent thermal conductivity for efficient heat transfer


• Outstanding compressibility for tight-gap filling


• Electrically non-conductive for safe use on electronics


• Easy to use and install


• Color: gray

Provides a reliable thermal interface between electronic components and cooling solutions to enhance heat dissipation in compact assemblies.

Thermal pad delivering excellent thermal conductivity and outstanding compressibility for efficient heat transfer in SSDs, GPU coolers and other electronic components.

The Minus Pad Pro is an electrically non-conductive thermal pad developed to improve thermal conductivity and compressibility while remaining easy to apply.

• Excellent thermal conductivity


• Outstanding compressibility for reliable contact


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Easy-to-use design ensures consistent thermal contact across a range of cooling and electronic applications.

Der 12. Gen Lapping-Tool ist speziell für den Intel 12. Gen Contact Frame konzipiert und vereinfacht den Prozess des Lappens des Prozessors. Mit den beiliegenden Schrauben wird die CPU einfach mit dem Contact Frame auf dem Lapping-Tool montiert. Dadurch wird die tatsächliche Endposition der CPU im Sockel auf dem Motherboard simuliert.

Der praktische AM5 Adapter & Offset Montagekit für AMDs Sockel-AM5-Motherboards enthält Kühlerhalterungen für die versetzte Montage der CPU sowie Adapter-Schrauben von UNC 6-32 auf M3 und M4 Gewinde. Die Adapter-Schrauben können verwendet werden, um CPU-Kühler zu montieren, die anstelle des UNC 6-32 Gewindes der Montageschrauben der Kühlerhalterung ein M3 oder M4 Gewinde erfordern, wie es bei verschiedenen AIOs oder Wasserkühlern der Fall ist. Mit den versetzten Halterungen können kompatible CPU-Kühler optional versetzt auf dem Prozessor montiert werden, um die Kühlleistung zu optimieren. Seit Einführung des Chiplet-Designs in Ryzen CPUs befindet sich der heißeste Punkt des Heat Spreaders nicht mehr in der Mitte, sondern wurde leicht nach unten und je nach CPU zum Rand hin verschoben.

Short back plate for AM5 motherboard, for mounting AM4 coolers with custom retaining kit on AM5, made from black anodised aluminium

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal pad with extremely high thermal conductivity and outstanding compressibility, electrically non-conductive and easy to apply for efficient heat transfer in electronic components.

The Minus Pad Pro builds on the proven Minus Pad 8 to deliver improved thermal performance and surface conformity, making it suitable for SSDs, GPU coolers, water-cooling blocks, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for better surface contact


• Electrically non-conductive


• Easy to use and install


• Designed for use with SSDs, GPUs, water coolers and electronic components


• Part of the Minus Pad Basic, Advance and Pro series; further developed from Minus Pad 8

Gray material adapts to uneven surfaces to improve contact between components and heatsinks for more reliable heat transfer.

Thermo-Pad, Red Brown

Thermo-Pad, Red Brown