CPU-Kontaktdichtungsrahmen, Rot/Schwarz, Schwarz

Thermo-Pad, Red Brown

GPU power monitoring device measures and records graphics card power through the 12VHPWR connector, displays real-time watts/volts/amps on an OLED, detects connector type, monitors temperatures and issues an audible alarm for over-current, over-temperature or misconnected/incorrect cables.

Designed for in-line measurement, the WireView Pro GPU connects between the graphics card and the PSU to log power usage with a 60-second averaging mode and to detect power peaks and incorrect cable specifications.

• OLED display showing current W, V, A, min/max, 60s average (RAVG) and total energy (Wh)


• Records power consumption for analysis and comparison, with a special 60-second measurement cycle


• Connector detection for 150 W / 300 W / 450 W / 600 W specified cables


• Internal temperature sensors at the power connectors plus two external 10K NTC sensors (5 cm and 20 cm included)


• Audible buzzer with adjustable temperature and current limits; warns on incorrect or loose cable connections


• Available in Normal and Reverse 12VHPWR orientations and connects to the PSU via the power cable

Be aware that the WireView PCB and connectors can become very hot during use—up to about 60°C with air-cooled cards and up to 100°C with water-cooled cards without airflow—so allow it to cool before handling.

Device for measuring and monitoring graphics card power consumption via the 12VHPWR connector with OLED readout, connector detection, temperature sensors and an audible alarm.

The WireView Pro GPU connects between the graphics card and the power supply to display and record volts, amps and watts on an OLED screen while detecting cable specification and issuing warnings for incorrect connections, overcurrent or overheating.

• Displays current power (W), voltage (V), current (A), min/max, 60‑second average (RAVG) and total energy (Wh)


• Measures and records power only through the 12VHPWR power connector (does not measure via the motherboard PCIe slot)


• Connector detection for 150W / 300W / 450W / 600W cable specs; available in Normal and Reverse pin orientations


• Internal temperature sensors at the power connectors plus two external 10K NTC sensors with 5 cm and 20 cm cables


• Audible buzzer alerts for incorrect cables/connections, exceeded temperature limits or adjustable current limits


• Aluminum housing with optimized cable management and an OLED for quick, review‑friendly measurements

Useful for assessing GPU power use and detecting power peaks on high‑power cards; the device can become very hot during operation, so avoid touching the casing and allow it to cool after shutdown.

Thermal putty that serves as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates for height differences from 0.2 to 3.0 mm.

TG Putty is easy to apply with the supplied spatulas or by hand (gloves recommended) and is available in Basic, Advance and Pro variants that differ by thermal conductivity.

• Electrically non-conductive alternative to conventional thermal pads


• Fills gaps from 0.2–3.0 mm for VRAM, VRM and SMD components


• Apply broadly with spatulas or shape into small pellets for precise placement


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Operating temperature range −40°C to +120°C


• Advance variant includes three spatulas for application

Designed for GPU modifications and cooler conversions, it adapts to varied factory pad thicknesses for tailored thermal contact.

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Thermal putty is an electrically non-conductive, flexible gap filler that replaces conventional thermal pads on GPUs and bridges height differences from 0.2 to 3.0 mm.

Formulated for GPU modifications, TG Putty is easy to shape for precise contact with VRAM and SMD components and can be applied broadly with a spatula or formed by hand.

• Electrically non-conductive alternative to thermal pads


• Fills gaps from 0.2 to 3.0 mm for consistent contact


• Apply with spatulas or by hand (gloves recommended)


• Available in variants with different thermal conductivities


• Operating range −40°C to +120°C


• Not suitable for use on processors (IHS or direct die) or directly on the GPU die

Easy to shape and tailor-made for memory and voltage-regulator contacts, it simplifies GPU pad replacement and cooler modifications.

Wärmeleitpaste für Prozessorkühler, Silber

Grafikkarten-Stromüberwachungsgerät für 12V-2x6 GPU-Steckverbinder mit stromstärkemessung pro Pin, TFT-IPS-Display, umgekehrter Steckerorientierung und aktiver Kühlung.

Thermal Grizzly WireView Pro II GPU misst Ströme, Spannungen, Temperaturen und Leistungsaufnahme kontinuierlich, mit visuellen und akustischen Warnungen, wenn definierte Grenzwerte überschritten werden.

Das Gerät unterstützt automatische Datenprotokollierung, konfigurierbare Anzeigeansichten, USB-C-Firmware-Updates und 90-degree-Kabelführung für ein aufgeräumteres GPU-Stromkabelmanagement.

Für präzises Steckverbinder-Monitoring entwickelt, erleichtert es die Nachverfolgung der Stromversorgung und Lastverteilung in Hochleistungs-Grafikkartensystemen.

Thermal pads offer improved thermal conductivity, high compressibility and electrical insulation for reliable heat transfer on SSDs, GPU coolers and other electronic components.

The Minus Pad Advance series refines the proven Minus Pad 8 formula with enhanced thermal performance and easier handling, making it suitable for SSDs, GPU water coolers, voltage regulators and memory modules.

• Electrically non-conductive for safe component contact


• Excellent thermal conductivity to aid heat dissipation


• High compressibility for better surface conformity


• Easy to use on a variety of cooling applications

Designed to improve heat transfer in compact cooling setups while remaining simple to apply.

Thermal pads with improved thermal conductivity, high compressibility and electrical insulation for effective heat transfer on SSDs, GPU coolers and electronic components.

The Minus Pad Advance pads are easy to use and were developed from the Minus Pad 8 to deliver improved thermal conductivity and higher compressibility.

• Excellent thermal conductivity


• High compressibility for better surface contact


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules


• Improved price-performance ratio

Designed to provide reliable heat transfer and gap filling across a range of PC and electronic cooling applications.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

GPU-Leistungsüberwachungsgerät für Grafikkarten mit 12V-2x6-Anschlüssen, mit per-Pin-Strommessung, kontinuierlicher Überwachung, einem TFT-IPS-Display, Datenprotokollierung und aktiver Kühlung.

Thermal Grizzly WireView Pro II wurde entwickelt, um sicherheitsrelevante Werte wie Strom, Spannung, Temperatur und Leistungsaufnahme zu überwachen, mit visuellen und akustischen Warnungen, wenn konfigurierte Grenzwerte überschritten werden.

• Per-Pin-Überwachung von Strom, Spannung und Leistung
• Automatische Protokollierung relevanter Betriebsdaten
• Semipassiver Lüfter und CNC-gefrästes Aluminiumgehäuse
• USB-C-Unterstützung für vom Benutzer durchgeführte Firmware-Updates

Es bietet einen klaren Einblick in die Belastung des GPU-Anschlusses und das Temperaturverhalten für eine fundiertere Systemüberwachung.

Thermo-Pad, Red Brown (Packung mit 2 )

With the Thermal Grizzly Minus Pad Advance, the Hamburg-based cooling specialist is expanding its product range with advanced thermal pads. Based on their predecessor, the Minus Pad 8, they have been further developed to significantly improve thermal conductivity.

The Minus Pad Advance is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heat sink needs to be bridged. It is therefore ideal for use with memory chips or voltage converters. It is based on a silicone-based carrier complex and aluminum oxide as a heat transfer medium, thus achieving thermal conductivity similar to thermal paste.

The Minus Pad is available in various dimensions and thicknesses from 0.5 to 3 millimeters. Since it works optimally even with minimal contact pressure and thermal conductivity is barely affected by the thickness, the choice of thickness should simply be tailored to the distance to be bridged.

Thermal Grizzly Duronaut is a high-performance thermal paste designed for excellent heat transfer and long-term stability.

Key features:
✔ Extremely durable
✔ High thermal conductivity
✔ Non-conductive & safe for electronics

Package includes:

1 × Duronaut thermal paste 2 g
1 × Applicator
1 × TG Spatula
1 × TG Spatula Pro

Thermo-Pad, Red Brown

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity
• High compressibility
• Easy to use
• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.
• Minus Pad Advance: Improved thermal conductivity, higher compressibility.
• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Der Delid-Die-Mate Intel 13th Gen ist ein Werkzeug zum Entfernen des Heat Spreaders ("Delidding") auf Intel-Prozessoren für den Sockel LGA1700. Durch das Entfernen des Heat Spreaders können die CPUs beispielsweise über "Direct Die" gekühlt werden. Bei der sogenannten "Direct Die" wird der CPU-Kühler direkt auf dem Prozessorchip montiert. Durch das Weglassen des Heat Spreaders im Kühlkreislauf ist eine deutlich optimierte Wärmeübertragung vom Die zum CPU-Kühler möglich.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Wärmeleitpaste

Thermal Grizzly Duronaut is a high-performance thermal paste designed for excellent heat transfer and long-term stability.

Key features:
✔ Extremely durable
✔ High thermal conductivity
✔ Non-conductive & safe for electronics

Package includes:

1x Duronaut thermal paste 6g
1x Applicator
1x TG Spatula
1x TG Spatula Pro
 

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Fettspachtel (Packung mit 3)

Wärmeleitpaste, Hellgrau