Thermal Grizzly – Wärmeleitpaste und Kühllösungen für PCs

Thermal putty acts as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates height differences from 0.2 mm to 3.0 mm while remaining easy to apply.

The TG Putty line is available in three variants with differing thermal conductivity and is supplied with spatulas to enable straightforward, large-area application.

• Electrically non-conductive alternative to conventional thermal pads


• Compensates gaps from 0.2–3.0 mm


• Three variants: Basic (medium), Advance (good), Pro (excellent) thermal conductivity


• Includes three spatulas for application


• Operating temperature range −40°C to +120°C


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Apply only to clean, degreased surfaces (e.g., TG Cleaning Wipes or isopropanol)

Suited for replacing VRAM and VRM pads on single and larger graphics cards and for converting coolers to GPU water cooling setups.

Wärmeleitpaste mit 12,5 W/m·K Leitfähigkeit, Einsatzbereich −250 bis +350 °C, nicht elektrisch leitend, Viskosität 120–170 Pa·s und 1 g Inhalt.

Speziell für anspruchsvolles Overclocking entwickelt liefert die Paste zuverlässige Performance ohne Aushärten und mit langzeitstabiler Konsistenz. Die fein abgestimmte Formel auf Basis von Nano-Aluminium- und Zinkoxid-Partikeln füllt Mikrounebenheiten sauber aus und sorgt für niedrige thermische Übergangswiderstände. Dank präzisem Applikator gelingt eine gleichmäßige, dünne Schicht auf CPU, GPU & Heatsink.

• Leitfähigkeit: 12,5 W/m·K für effiziente Wärmeübertragung.
• Temperaturbereich: −250 bis +350 °C für Kryo-Setups bis Hochlast.
• Viskosität: ca. 120–170 Pa·s – leicht zu verteilen, bleibt formstabil.
• Zusammensetzung: Nano-Aluminium & Zinkoxid, nicht elektrisch leitend.
• Dichte: ~3,7 g/cm³ für dünne, homogene Schichten.
• Handhabung: keine Aushärtung, langzeitstabil; flacher Aufsatz/Spachtel für präzises Auftragen.
• Variante: 1 g Tube, Modell TG-K-001-BS (Kryonaut).

Flüssigmetall-Kühlpaste, Silberpaste, Dichte: 6,29 g/cm³, Betriebstemperatur: -50 - 200° C, 1 Gramm

Wärmeleitpads bieten hohe Wärmeleitfähigkeit mit einer sehr elastischen, flexiblen Oberfläche, die selbst kleinste Spalten zwischen Komponenten ausgleichen soll.

Thermal Grizzly Minus Pad 8 lässt sich leicht verarbeiten und mit leichtem Druck anbringen. Es nutzt eine keramische Silikon-Formel und Nano-Aluminiumoxid, um eine konstante, optimale Wärmeübertragung in vielen Größen und Stärken zu unterstützen.

• Hohe Wärmeleitfähigkeit
• Hohe Kompressibilität
• Elektrische Isolierung
• RoHS-konform

Zuverlässiger Kontakt und effizienter Wärmetransfer helfen, empfindliche Komponenten thermisch verbunden und stabil zu halten.

Water cooler for direct‑die mounting on AMD AM5 CPUs featuring a nickel‑plated copper cold plate, a hybrid microfin structure with a jet plate for optimized flow and integrated ARGB lighting.

The AMD Mycro Direct-Die Pro is engineered for delidded AM5 processors, replacing the SAM and heatspreader to sit directly on the silicon while the nickel plating limits gallium-based liquid metal diffusion and the hybrid fin design reduces flow resistance.

• Direct‑die mounting for delidded CPUs (requires removal of Socket Actuation Mechanism)


• Nickel‑plated copper cold plate with two sizes of microfins and jet plate


• Annealed acrylic under an anodized aluminum cover to prevent stress cracks


• Digital ARGB LEDs under the cover, controlled via 3‑pin ARGB header (+5V/DATA/GND); LEDs illuminate the acrylic and G1/4 connectors


• G1/4‑inch connections for coolant lines


• Compatibility: generally compatible with Ryzen 9000 series including X3D variants; not compatible with Ryzen 5 7400F or Ryzen 8000G APUs (As of September 2025)


• Includes insulation sheet, 600 mbar pressure test report, mounting screws and wrenches

Provides direct‑die cooling with optimized flow and integrated lighting while the nickel plating reduces the need for repeated liquid‑metal applications.

Aeronaut thermal grease is the ideal beginner's product with high effectiveness. Great surface protection, as well as good heat transfer capabilites make Aeronaut the ideal choice for users who want to optimize their cooling solution in an effective way, or maybe want to use an alternative to the thermal grease included with their hardware, with a remarkable cost effectiveness to boot.

• very good thermal conductivity
• long-term durability
• no curing
• no electrical conductivity

Thermo-Pad, Red Brown

The Intel High Performance Heatspreader V1 is an upgrade heatspreader for Intel processors. The nickel-plated copper heatspreader has a 207 percent larger, diamond-milled precision surface. This increased surface area compared to the original heatspreader enables maximum heat dissipation for air and water coolers, while the precision milling ensures extremely low surface roughness for the best contact with the heat sink.

The Intel High Performance Heatspreader V1 is compatible with the following processors:

Intel 12th Gen CPUs
Intel 13th Gen CPUs
Intel 14th Gen CPUs (200s)

Scope of delivery

1x Intel High Performance Heatspreader V1
4x pan-head screws UNC thread 3/8"
1x hexagon socket wrench 5/64"
1x angle wrench Torx T20
 

Device for measuring and monitoring graphics card power consumption via the 12VHPWR connector with OLED readout, connector detection, temperature sensors and an audible alarm.

The WireView Pro GPU connects between the graphics card and the power supply to display and record volts, amps and watts on an OLED screen while detecting cable specification and issuing warnings for incorrect connections, overcurrent or overheating.

• Displays current power (W), voltage (V), current (A), min/max, 60‑second average (RAVG) and total energy (Wh)


• Measures and records power only through the 12VHPWR power connector (does not measure via the motherboard PCIe slot)


• Connector detection for 150W / 300W / 450W / 600W cable specs; available in Normal and Reverse pin orientations


• Internal temperature sensors at the power connectors plus two external 10K NTC sensors with 5 cm and 20 cm cables


• Audible buzzer alerts for incorrect cables/connections, exceeded temperature limits or adjustable current limits


• Aluminum housing with optimized cable management and an OLED for quick, review‑friendly measurements

Useful for assessing GPU power use and detecting power peaks on high‑power cards; the device can become very hot during operation, so avoid touching the casing and allow it to cool after shutdown.

The PhaseSheet PTM is a thermal pad based on a phase change material (PCM). The pads, which are solid at room temperature, can be easily applied and liquefy during operation, allowing them to effectively dissipate heat like a thermal paste. PhaseSheet PTM is electrically non-conductive and can therefore be used in many areas, with the primary application being in processors and graphics chips.

Thermal pads offer improved thermal conductivity, high compressibility and electrical insulation for reliable heat transfer on SSDs, GPU coolers and other electronic components.

The Minus Pad Advance series refines the proven Minus Pad 8 formula with enhanced thermal performance and easier handling, making it suitable for SSDs, GPU water coolers, voltage regulators and memory modules.

• Electrically non-conductive for safe component contact


• Excellent thermal conductivity to aid heat dissipation


• High compressibility for better surface conformity


• Easy to use on a variety of cooling applications

Designed to improve heat transfer in compact cooling setups while remaining simple to apply.

Thermal Grizzly Duronaut is a high-performance thermal paste designed for excellent heat transfer and long-term stability.

Key features:
✔ Extremely durable
✔ High thermal conductivity
✔ Non-conductive & safe for electronics

Package includes:

1x Duronaut thermal paste 6g
1x Applicator
1x TG Spatula
1x TG Spatula Pro
 

Thermo-Pad, Red Brown

GPU power monitoring device measures and records graphics card power through the 12VHPWR connector, displays real-time watts/volts/amps on an OLED, detects connector type, monitors temperatures and issues an audible alarm for over-current, over-temperature or misconnected/incorrect cables.

Designed for in-line measurement, the WireView Pro GPU connects between the graphics card and the PSU to log power usage with a 60-second averaging mode and to detect power peaks and incorrect cable specifications.

• OLED display showing current W, V, A, min/max, 60s average (RAVG) and total energy (Wh)


• Records power consumption for analysis and comparison, with a special 60-second measurement cycle


• Connector detection for 150 W / 300 W / 450 W / 600 W specified cables


• Internal temperature sensors at the power connectors plus two external 10K NTC sensors (5 cm and 20 cm included)


• Audible buzzer with adjustable temperature and current limits; warns on incorrect or loose cable connections


• Available in Normal and Reverse 12VHPWR orientations and connects to the PSU via the power cable

Be aware that the WireView PCB and connectors can become very hot during use—up to about 60°C with air-cooled cards and up to 100°C with water-cooled cards without airflow—so allow it to cool before handling.

Thermal pad with extremely high thermal conductivity and outstanding compressibility, electrically non-conductive and easy to apply for efficient heat transfer in electronic components.

The Minus Pad Pro builds on the proven Minus Pad 8 to deliver improved thermal performance and surface conformity, making it suitable for SSDs, GPU coolers, water-cooling blocks, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for better surface contact


• Electrically non-conductive


• Easy to use and install


• Designed for use with SSDs, GPUs, water coolers and electronic components


• Part of the Minus Pad Basic, Advance and Pro series; further developed from Minus Pad 8

Gray material adapts to uneven surfaces to improve contact between components and heatsinks for more reliable heat transfer.

Hochleistungs-Wärmeleitpaste mit 14,2 W/m·K, 2-g-Spritze (TG-KE-002-R), nicht elektrisch leitend, optimiert für niedrige Temperaturen (-250 bis +350 °C), inkl. Applikatoren – ideal für CPU/GPU und extremes Overclocking.

Kryonaut Extreme nutzt eine extrem feine Partikelgröße und minimal mögliche Schichtdicke, um die Wärmeübertragung auf ein neues Level zu heben – selbst bei LN2- oder Trockeneis-Setups. Die Rezeptur bleibt auch unter hoher Last formstabil und trocknet nicht aus, zusätzliche nano-Aluminiumoxid-Partikel füllen mikroskopische Unebenheiten zuverlässig. So holst du aus High-End-Kühlern und Wasserkühlungen konstant niedrige Temperaturen heraus.

• Wärmeleitfähigkeit: 14,2 W/m·K für maximale Performance bei Luft- und Wasserkühlung
• Temperaturbereich: ca. −250 bis +350 °C – geeignet von Alltagsbetrieb bis Sub-Zero-OCs
• Sicherheit: elektrisch nicht leitend und nicht korrosiv – minimiert Kurzschlussrisiken
• Konsistenz: hochviskos (≈130–180 Pa·s) für präzises, dünnes Auftragen
• Inhalt & Farbe: 2 g in Spritze, charakteristische „pink“ Paste
• Lieferumfang: 2 Applikatoren, Quick-Start-Guide, Echtheitscode
• Einsatzgebiet: CPU/GPU, Heatsinks, Direct-Die & Bench-Sessions mit LN2/DI

CPU Contact Frame improves cooling by shifting contact pressure to the edges, preventing IHS concavity and enabling better cooler contact on Intel LGA1700 sockets.

The Thermal Grizzly CPU Contact Frame Intel 1700 LT is the injection-molded "Lite" mounting frame made from ABS reinforced with 15% glass fiber that replaces the standard ILM to increase contact surface and simplify installation.

• Injection-molded ABS with 15% glass fiber for added stability


• Inner contour shifts pressure from centre to edges to avoid concave IHS


• Designed for Intel LGA1700; compatible with 12th, 13th and 14th Gen CPUs


• Only for CPUs whose IHS has been ground down by no more than 0.2 mm


• Includes 4 pan-head screws (UNC 3/8"), 5/64" hex socket wrench and Torx T20 angle wrench

Simple installation and improved cooler contact can lead to noticeably lower CPU temperatures depending on the cooler and processor.

Wärmeleitpaste, für Overclocking konzipiert, 14,2 W/m*K Wärmeleitfähigkeit, keine Aushärtung erforderlich, 33.84 Gramm

Der CPU-Montagerahmen ermöglicht Direct-Die-Montage für AMD Ryzen 7000-Prozessoren auf AM5, indem der integrierte Heatspreader weggelassen wird, was zu deutlich niedrigeren Betriebstemperaturen führt.

Der Thermal Grizzly Ryzen 7000 Direct Die Frame lässt deinen CPU-Kühler direkt mit den Chiplets des Prozessors in Kontakt kommen, für eine effizientere Wärmeabfuhr, und hilft gleichzeitig, die freiliegenden Chiplets vor Anpressdruck zu schützen, der die CPU-Funktion beeinträchtigen kann.

• Kompatibel mit AMD Ryzen 7000 (inkl. Ryzen 7000 V2)
• Ermöglicht die Montage von geköpften Ryzen-CPUs
• Einfache Montage
• Eloxierte Aluminiumkonstruktion in Schwarz

Ideal für Extreme-Overclocker, Gamer und Content Creator, die eine verbesserte Kühlung durch direkte Wärmeübertragung suchen.

Thermal putty is an electrically non-conductive, flexible gap filler that replaces conventional thermal pads on GPUs and bridges height differences from 0.2 to 3.0 mm.

Formulated for GPU modifications, TG Putty is easy to shape for precise contact with VRAM and SMD components and can be applied broadly with a spatula or formed by hand.

• Electrically non-conductive alternative to thermal pads


• Fills gaps from 0.2 to 3.0 mm for consistent contact


• Apply with spatulas or by hand (gloves recommended)


• Available in variants with different thermal conductivities


• Operating range −40°C to +120°C


• Not suitable for use on processors (IHS or direct die) or directly on the GPU die

Easy to shape and tailor-made for memory and voltage-regulator contacts, it simplifies GPU pad replacement and cooler modifications.

Thermal Grizzly TG Shield ist eine Hochtemperatur-Konformbeschichtung zum Schutz von Komponenten vor Kurzschlüssen durch Flüssigmetall. TG Shield trocknet schnell für eine schnelle Anwendung und bietet in Kombination mit Flüssigmetall zuverlässigen Schutz von PC-Komponenten.

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Wärmeleitpad bietet hohe Kompression, sehr hohe Kompressibilität und Wärmeleitfähigkeit in einer elektrisch nicht leitfähigen Ausführung für eine einfache Installation.

Thermal Grizzly Minus Pad High Compression ist für PC-Enthusiasten und Modder konzipiert, die ein flexibles Pad benötigen, das unterschiedliche Bauteilhöhen zuverlässig ausgleicht – ohne komplizierte Messungen – und sich für eine Vielzahl von Builds zuschneiden lässt.

• Hohe Kompressibilität hilft, Höhenunterschiede auszugleichen, wenn der exakte Spalt unbekannt ist
• Hervorragende Wärmeleitfähigkeit unterstützt effizienten Wärmeaustausch
• Elektrisch nicht leitfähig und hilft, Kurzschlüsse in empfindlicher Elektronik zu vermeiden
• Vielseitig einsetzbar für SSDs, Laptops, VRMs und Grafikkarten

Ideal für praktische Kühl-Upgrades, bei denen Toleranz, Sicherheit und einfache Handhabung zählen.

Wärmeleitpaste, Hellgrau

Wärmeleitpaste für Prozessorkühler, Silber