CPU Kühler - Seite 14

Thermo-Pad, Schwarz (Packung mit 4)

Thermal pad with extremely high thermal conductivity, outstanding compressibility and electrical non-conductivity for reliable heat transfer on SSDs, GPU coolers and electronic components.

The Minus Pad Pro is part of the Minus Pad series and builds on the proven Minus Pad 8 to deliver improved thermal conductivity and compressibility while remaining easy to use.

• Excellent thermal conductivity


• Outstanding compressibility


• Easy to use


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules


• Color: gray

Provides a compressible, electrically isolating interface to enhance thermal contact between components and cooling solutions.

Thermal pads offering extremely high thermal conductivity, outstanding compressibility and electrically non-conductive properties for use on SSDs, GPU coolers and electronic components.

The Minus Pad Pro combines excellent heat transfer with exceptional compressibility while remaining electrically non-conductive, making it suitable for cooling SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for tight contact


• Electrically non-conductive for safe use on electronics


• Easy to use


• Designed for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Based on the proven Minus Pad 8 and developed to further improve thermal conductivity and compressibility for reliable component cooling.

Thermal pads offer extremely high thermal conductivity, outstanding compressibility, electrical insulation, and straightforward installation for efficient component cooling.

The Minus Pad Pro is the Pro-series thermal pad refined from the Minus Pad 8 to deliver improved thermal conductivity and compressibility for SSDs, GPU coolers, water blocks and electronic components.

• Excellent thermal conductivity


• Outstanding compressibility for tight contact


• Electrically non-conductive


• Easy to apply


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Designed to enhance heat transfer between components and cooling solutions in compact assemblies.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Prozessor-Wasserkühlsystem Thermalright Frozen Guardian 360 Black kombiniert eine Asetek Gen 8 Pumpe der 8. Generation, einen 360 mm Aluminium-Radiator und drei 120 mm TL-K12 PWM-Lüfter mit 5V ARGB-Beleuchtung.

Für moderne PC-Builds entwickelt, unterstützt dieser All-in-One CPU-Wasserkühler Intel LGA115X/1200/1700/1851 und AMD AM4/AM5 Sockel und nutzt 4-Pin-PWM-Steuerung für Pumpe und Lüfter, um Luftdurchsatz, Druck und Geräuschentwicklung auszubalancieren.

• 360 mm Aluminium-Radiator
• Drei 120 mm-Lüfter mit S-FDB V2 Lager
• Lüfterdrehzahl bis zu 2150 RPM
• Luftdurchsatz bis zu 69 CFM und Luftdruck bis zu 2.87 mm H2O
• Niedriger Geräuschpegel von 27 dBA
• 4-Pin-PWM-Anschlüsse und 3-Pin 5V ARGB-Anschluss

Starke Sockelkompatibilität und unkomplizierte PWM/ARGB-Konnektivität erleichtern die Integration in ein leistungsstarkes Gaming- oder Workstation-System.

Prozessor-Flüssigkeitskühlsystem, Kühlergröße: 360 mm, (für: AM3, AM4, LGA115x Socket, LGA1200, LGA1700, LGA20XX), Kupfer, 120 mm

Der praktische AM5 Adapter & Offset Montagekit für AMDs Sockel-AM5-Motherboards enthält Kühlerhalterungen für die versetzte Montage der CPU sowie Adapter-Schrauben von UNC 6-32 auf M3 und M4 Gewinde. Die Adapter-Schrauben können verwendet werden, um CPU-Kühler zu montieren, die anstelle des UNC 6-32 Gewindes der Montageschrauben der Kühlerhalterung ein M3 oder M4 Gewinde erfordern, wie es bei verschiedenen AIOs oder Wasserkühlern der Fall ist. Mit den versetzten Halterungen können kompatible CPU-Kühler optional versetzt auf dem Prozessor montiert werden, um die Kühlleistung zu optimieren. Seit Einführung des Chiplet-Designs in Ryzen CPUs befindet sich der heißeste Punkt des Heat Spreaders nicht mehr in der Mitte, sondern wurde leicht nach unten und je nach CPU zum Rand hin verschoben.

Der 12. Gen Lapping-Tool ist speziell für den Intel 12. Gen Contact Frame konzipiert und vereinfacht den Prozess des Lappens des Prozessors. Mit den beiliegenden Schrauben wird die CPU einfach mit dem Contact Frame auf dem Lapping-Tool montiert. Dadurch wird die tatsächliche Endposition der CPU im Sockel auf dem Motherboard simuliert.

Thermal pad delivering excellent thermal conductivity and outstanding compressibility while remaining electrically non-conductive and easy to apply.

The Minus Pad Pro is part of the Minus Pad series, developed from the proven Minus Pad 8 to boost thermal performance and compressibility for components such as SSDs, GPU coolers, GPU water-cooling setups, voltage regulators and memory modules.

• Excellent thermal conductivity for efficient heat transfer


• Outstanding compressibility for tight-gap filling


• Electrically non-conductive for safe use on electronics


• Easy to use and install


• Color: gray

Provides a reliable thermal interface between electronic components and cooling solutions to enhance heat dissipation in compact assemblies.

Thermal pad delivering excellent thermal conductivity and outstanding compressibility for efficient heat transfer in SSDs, GPU coolers and other electronic components.

The Minus Pad Pro is an electrically non-conductive thermal pad developed to improve thermal conductivity and compressibility while remaining easy to apply.

• Excellent thermal conductivity


• Outstanding compressibility for reliable contact


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Easy-to-use design ensures consistent thermal contact across a range of cooling and electronic applications.

CPU-Wasserkühler Thermalright Frozen Guardian 360 White kombiniert eine Asetek Gen 8 Pumpe der 8. Generation, einen 360 mm Aluminium-Radiator und drei 120 mm PWM-Lüfter mit ARGB-fähigen Anschlüssen.

Für Intel LGA115x/1200/1700/1851 und AMD AM4/AM5 Plattformen entwickelt, nutzt dieses All-in-One-Wasserkühlsystem eine 12V DC Pumpe und TL-K12W 120 mm-Lüfter, um ausgewogenen Luftdurchsatz, Druck und Akustik zu liefern, mit Lüfterdrehzahlen bis zu 2150 rpm und Geräuschpegeln bis zu 27 dBA.

• Sockelunterstützung: Intel LGA115x/1200/1700/1851 und AMD AM4/AM5
• Radiator-Material: Aluminium
• Drei 120 mm-Lüfter mit S-FDB V2 Lager
• Luftdurchsatz bis zu 69 CFM und Luftdruck bis zu 2.87 mm H2O
• Anschlüsse: 4-Pin PWM (Pumpe/Lüfter) und 3-Pin 5V ARGB (Lüfter)

Solide Sockelkompatibilität und PWM/ARGB-Konnektivität erleichtern die Integration in moderne Builds mit kontrollierter Kühlleistung.

Short back plate for AM5 motherboard, for mounting AM4 coolers with custom retaining kit on AM5, made from black anodised aluminium

CPU-Kühler Antec A30 PRO ist ein luftgekühlter CPU-Kühler mit blauem LED-Lüfter, 2 Heatpipes, Aluminiumlamellen und Unterstützung für Intel- und AMD-Sockel.

Der LED-Lüfter läuft mit 1800 ± 10% U/min bei bis zu 33.4 CFM Luftdurchsatz, 0.8 mmH2O Luftdruck und einem maximalen Geräuschpegel von 35 dB(A).

• Kühltyp: Luftkühlung
• Lüftertyp: LED-Lüfter
• Anschluss: 3-Pin
• Nennspannung: 12VDC
• TDP: 95 W
• Sockelkompatibilität: Intel LGA 775 / 115X / 1200 / 1700 und AMD AM5 / AM4 / FM2 / FM1 / AM3+ / AM3 / AM2+ / AM2

A30 PRO liefert praktische LED-Luftkühlung für kompatible Core i3 / i5- und AMD-CPU-Setups.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

CPU-Kühler, wasserkühlsystem, passt zu AMD Socket AM4 / AM5 & Intel Socket LGA1150 / LGA1151 / LGA1155 / LGA1156 / LGA1200 / LGA1700 / LGA1851, Kühler Geräuschpegel: max 29 dBA, Kühler-RPM: max 2200 ± 10%, Kühler CFM: max 76.2, statischer Druck: max 3.81 mmH₂O, PWM-gesteuert, 277mm radiator mit 2 x 120mm RGB Kühler, 4-Pins PWM & 3-Pins ARGB Anschluss, inkl. Kühlpaste, schwarz mit RGB•

Wärmeleitpad, grau, Wärmeleitfähigkeit: 8.5 W/(mK), Größe: 30 x 40 x 0.2 mm – für Intel LGA115x / LGA1200 / LGA1700 CPUs

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal pad with extremely high thermal conductivity and outstanding compressibility, electrically non-conductive and easy to apply for efficient heat transfer in electronic components.

The Minus Pad Pro builds on the proven Minus Pad 8 to deliver improved thermal performance and surface conformity, making it suitable for SSDs, GPU coolers, water-cooling blocks, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for better surface contact


• Electrically non-conductive


• Easy to use and install


• Designed for use with SSDs, GPUs, water coolers and electronic components


• Part of the Minus Pad Basic, Advance and Pro series; further developed from Minus Pad 8

Gray material adapts to uneven surfaces to improve contact between components and heatsinks for more reliable heat transfer.

Thermo-Pad, Red Brown

Thermo-Pad, Red Brown

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

CPU-Kühler, luft-Kühler, passt zu AMD Socket AM4 / AM5 & Intel Socket LGA1150 / LGA1151 / LGA1155 / LGA1156 / LGA1200 / LGA1700 / LGA1851, Geräuschpegel: max 34.8 dBA, Luftstrom: max 61.8 CFM, statischer Druck: max 2.51 mmH₂O, Kühler-RPM: - max 2000 ± 10%, PWM-gesteuert, 4-Pins PWM Anschluss, 2 x 120mm Kühler, 6 Heatpipes, Kühlerhöhe: 155mm, inkl. Kühlpaste, Farbe: schwarz

CPU-Kühler, wasserkühlsystem, passt zu AMD Socket AM4 / AM5 & Intel Socket LGA1700 / LGA1851, Geräuschpegel: max 31 dBA (Kühler) / max 28 dBA (pumpen), Kühler-RPM: 02600 ± 10%, Kühler CFM: max 72, statischer Druck: max 3 mmH₂O, PWM-gesteuert, 360mm radiator mit 3 x 120mm RGB Kühler, 4-Pins PWM & 3-Pins ARGB Anschluss, inkl. Kühlpaste, eingebauter Bildschirm eingebauter Bildschirm, schwarz mit RGB (kontrolliert von: ASUS AURA / Asrock Polychrome Sync / Gigabyte Fusion / MSI Mystic Light)•